Etcher
Etching System
E-MAX
![](images/product1_img95_t.gif)
Process: Poly Etch
Wafer Size : 8"
Electrostatic chuck (ESC)
Normal : 3 Chamber, Max : 4Chamber
Centura DPS
![](images/product1_img94_t.gif)
Unibody Chamber
Chamber Liner
Diffusion Plasma Shield
STI Process Progress
WSix / Poly Etch simulaneously progress