Physical Vapor Deposition
Varian XM-90
                                        Varian - Inline System
                                        Back & Front side deposition process 
                                        Wafer Size : 4" to 6"
                                        Versamag Source
                                        Option : Etch, Deposition
                                        Meterial : Al, Ti, Au, Ag, Ni, Cr, Va
Varian-3000 Series
                                        Varian - Inline System
                                        3180 / 3190 / 3280 / 3290
                                        Wafer Size : 4" to 6"
                                        ConMag & Quantum Source
                                        Option : Etch, 3 Deposition, VIPS
                                        Meterial : Al, Ti, TiW, Au, Ag
Varian-M2000
                                        Varian - Cluster System
                                        Wafer Size : 5" to 8"
                                        Dual cassette loadlock
                                        Option : Degas, Cool, Etch, Deposition, CDS Deposition
                                        Meterial : Al, Ti, TiN, Tiw, Au
Varian-M2i
                                        Varian - Cluster System
                                        Wafer Size : 5" to 8"
                                        Dual cassette loadlock
                                        Option : Degas, Cool, Etch, Deposition, CDS Deposition
                                        Meterial : Al, Ti, TiN, Tiw, Au
Endura
                                        AMAT - Cluster System
                                        Wafer Size : 6" to 8"
                                        ConMag & Quantum Source
                                        Option : Robot arm, Loadlock body, Degas,
                                                  Cool, Pre-II, IMP, CDS Deposition,
                                                  SIP, Heater, E-chuck (Lo/Hi temp)
                                        Meterial : Al, Ti, TiN, TiW, WSi, MOCVD
Fronos
                                        Maestech - Inline System
                                        Wafer Size : 6" to 8"
                                        Back & Front side deposition process 
                                        Option : Etch, Deposition
                                        Meterial :  Al, Ti, Au, Ag, Ni, Cr, Va
